Epoxy resin is a kind of polymer that by annulus oxygen radical group makes, pair of phenol radical and annulus oxygen are contained normally in its structure base. Such structure makes epoxy resin has good mechanical performance, chemical stability and electric property, at the same time its still have the quality such as inferior noxiousness and machinability. The article undertakes through enclosing epoxy resin material to semiconductor property is analysed, discuss this material to enclose the property such as medium application and its physics, chemical, machinery in semiconductor, the application that is this material provides research foundation and academic guidance.
1.Foreword encloses the ceaseless development of the industry as semiconductor, semiconductor encloses the choice of material and research to become more and more important. Among them, semiconductor encloses epoxy resin material to serve as a kind of high-powered data, be applied extensively at semiconductor to enclose a domain. The article will undertake to this material property is analysed, with period for its research and application provide a help. 2. The physical property epoxy resin of epoxy resin is compound of a kind of high polymer, have good physical performance. Among them, its density is 1.2-1.4g/cm3 about, hardness is between 70-80, hot coefficient of expansion is between 1.5-7ppm/K. In addition, epoxy resin still has good wearability to be able to be mixed fight ultraviolet function, can stabilize the job for a long time below harsh environment. 3. Epoxy resin has the chemistry of epoxy resin good chemical stability and chemical reaction active. Below constant temperature and condition, epoxy resin can produce chemical reaction with a variety of chemical material. For example, with amine compound reaction can produce amine radical polymer, with second acid anhydride reaction can produce acerbity ester of annulus oxygen second to wait. In addition, heating below, epoxy resin still can produce aggregate reaction, form high polymer compound. 4. The mechanical nature epoxy resin of epoxy resin has good mechanical performance, its tensile strength is commonly between 60-80MPa, stretch model quantity is between 2-4GPa, percentage elongation is between 2-5% . In addition, epoxy resin anti-impact properties is more outstanding also, still can not happen below bigger concussion load rupture. 5. The epoxy resin material that semiconductor encloses medium applied semiconductor to enclose middling to use basically has get together acyl inferior amine film, organic silica gel, epoxy resin. Among them, epoxy resin because the character of its chemistry reaction and mechanical function, became a kind of special ideal enclose material. In BGA (ball bar array) , QFN (without cite a base compressed enclose) wait for a variety of enclosing in the form, epoxy resin material got applied extensively. In enclosing a process, this material can secure chip and down-lead, protect chip and offer machinery to prop up. (1) ball bar array encloses (BGA) : Epoxy resin material can offer good hot coupling function and stick receive performance, assure the dependability of BGA parts of an apparatus and stability; (2) brilliant round class encloses (WLP) : Epoxy resin material needs to have good liquidity, enclose function and shape function, in order to assure the good performance of WLP parts of an apparatus; (3) transistor encloses: Material need has epoxy resin to fight ultraviolet function, flame retardation and insulation property goodly, in order to ensure of transistor move normally; (4) other parts of an apparatus encloses: Epoxy resin material returns applicable to be enclosed at LED, the solar battery is enclosed wait for other sphere. 6. The method that property of epoxy resin material analyses the property to epoxy resin material, researcher passes a variety of analysis methods to undertake assessment normally. Among them, the commonnest method includes: 1. Drawing checks: Use universal test machine to undertake to material drawing checks normally, with evaluating its intensity is mixed extend a gender. 2. Heat up an analysis: Basically use the analysis that differ heat (DSC) , hot serious analysis (TGA) analyse with hot weightlessness (DTA) the parameter such as the thermal stability that waits for a method to have pair of stuff, hot coefficient of expansion has a test. 3. Dynamic and mechanical analysis: Learn analyzer through dynamic force (DMA) wait to change of the gelation behavior of epoxy resin, vitrification undertake study. 4. Token checks: Include scanning electron microscope (SEM) , X ray is diffractive (XRD) , infra-red spectrum (FTIR) etc undertake the chemical composition of rarefied epoxy resin material reachs a structure to wait is opposite undertake analytic token.
