According to announcement of bureau of national intellectual property, fair science and technology (600143) Inc. applies for the name is “ compound laser beam welding of a kind of PC/ABS receives black material and its preparation method and applied “ , make public date CN117341309A, application date is in November 2023.

Patent summary shows, this invention belongs to a project plastic technology domain, specific involve compound laser beam welding of a kind of PC/ABS to receive black material and its preparation method and application. What narrate PC/ABS compound laser beam welding to receive black data, include pervious to light layer and layer suction light, pervious to light the layer includes the following weight respectively with layer suction light the constituent of portion plan: PC colophony colophony of 5085 portion, ABS 522 portion, fire retardant 113 portion, photographs allow 518 portion, flexibilizer agent auxiliary of 16 portion, laser 0.15; What narrate ABS resinous average bead diameter is 250650nm; Be narrated pervious to light the laser auxiliary of the layer is solvent dye; The laser auxiliary of layer suction light is carbon black. The compound laser beam welding that this invention makes receives material to break through color and material to be restricted character, the color off color that two lay on is in 1 less than, implementation is pervious to light layer and the laser that suck smooth layer to be PC/ABS black material together solder.