Epoxy resin adhesive is the adhesive that waits for composition by agent of EP, solidify, flexibilizer and filling. EP adhesive is had stick receive strength tall, chemical stability is excellent with systole [1~5] rate is low, machine easily shape wait for an advantage, application is consequently wide. Often need to be able to be in already in practice the adhesive that cold curing can use in high temperature environment again. Build used structural adhesive for example, ask to be able to be able to bear or endure not only suffer high temperature to collapse with preventing a building to break down in the whole in fire, because stick,still receive an area to heat impossibly greatly solidify. But, adhesive of cold curing EP cannot be used below high temperature commonly, and the EP adhesive of heat-resisting often needs to heat ability is complete solidify. Alleged cold curing, it is to point to normally can be in room temperature (30 ℃ of 20 ～ ) below the condition a few Min or the gel inside a few H, be in 7 D less than is complete solidify, obtain the solidify means of usable intensity. And high temperature resistant adhesive asks to reach the following level commonly: ① in 121 ～ 176 ℃ use 1 ～ 5 A, or in 204 ～ 232 ℃ use 4 000 H of 2 000 ～ ; ② in 260 ～ 371 ℃ use 200 ～ 1 000h; ③ in 371 ～ 427 ℃ use 24 ～ 200 H; ④ in 538 ～ 816 ℃ make [6] uses 2 ～ 10 Min. Development can be in already the main task that the epoxy resin adhesive that cold curing can use below high temperature again is scientific research worker. The article is domestic and international cold curing is high temperature resistant the research progress of EP adhesive and current situation undertook overview, analysis. 1. Foreign cold curing is high temperature resistant the 　 of general situation of research and development of EP adhesive chooses to matrix resinous and the synthesis of agent of solidify of modified, heat-resisting and heat-resisting filling, it is cold curing of research and development high temperature resistant the important facet of EP adhesive. The essence of agent of 1.1 tall active solidify and reaction of solidify of 　 of EP resinous modified is the annulus in EP oxygen radical group and solidify agent produce open loop polymerization to react and form cross-linking reticulate structure. Of EP adhesive be able to bear or endure lukewarm function basically depends on the structure of its solidify child, if solidify child is cross-linking to spend higher reticulate structure or contain can restrict catenary of solidify child element more relatively paragraph of motion base round, criterion condensate can have better be able to bear or endure lukewarm function. Because this can use tall functionality or Gao Fang,the solidify agent of nuclear density comes solidify EP. Sasidharan choose a liquid to carry balata of carboxyl fourth nitrile (CTBN) undertake modified to EP, and with 2, 4, 6- 3 (2 armour are amino and methylic) phenol is solidify agent, preparation the EP adhesive of cold curing, its use temperature to achieve 120 ℃ . This research returns discovery, although CTBN can have the favorable effect that add pliable but strong, but the CTBN of excessive meets those who weaken solidify production be able to bear or endure lukewarm [8] function. Mimura let get together ether sulphone (PES) the half each other that makes homogeneous phase with reaction of couplet phenyl EP wears network polymer, consider to make clear, should get together the dosage of ether sulphone is matrix colophony dosage 10% when, before the T of the EP after modified compares modified, lifted G20% . Investigator often uses many functionality EP to regard matrix as colophony, or use its [9] adhesive of preparation of EP of modified of his many functionality material. The Dodiuk child that reacts 4 luscious groups and cross-linking of aether of 3 glycerine of luscious round shrink EP regards matrix as colophony, xi radical much amine is mixed with how amino or the 2 olefin balata of carboxyl Feng Duan is assorted solidify system, preparation cold curing, still have the adhesive of good performance in 120 ℃ . Although of these EP adhesive be able to bear or endure lukewarm performance is not quite high, but the development that is adhesive of cold curing EP however offerred a train of thought. The Samuel J[10] EP that uses much face to assemble in modified of alkyl of oxygen of times half silicon to contain glycol aether of double phenolic F2, much face assembles in alkyl of oxygen of times half silicon to have the effect of cross-linking hub in the colophony after modified, in restricting EP base circular motion. The data that uses modified EP preparation after cold curing succumb intensity can amount to 281 Mpa, 200 ℃ curve meet an emergency below to be less than 0.1% , it is better to have be able to bear or endure lukewarm function, can use at large industry equipment [of 11] make. Samanta with get together amino benzoic acid of glycol and 4- changed reaction to synthesize end through ester amine radical gets together glycol / benzoic acid (ATPEGB) , use EP of aether of glycerine of shrink of A2 of its modified double phenol (DGEBA) make 2 person form cross-linking instead reticulate structure, again with 3 Xi 4 amine are solidify agent preparation a kind of cold curing is high temperature resistant EP adhesive. Consider to discover, it is 12.5 when the dosage of ATPEGB [when 12] , after adhesive cold curing, be able to bear or endure Wenkeda 315 ℃ . Amit is raw material with EP, use vacuum to assist colophony to deliver shape craft made carbon fiber enhance composite material, can be in cold curing, hopeful replaces the composite material of vinyl ester colophony that is used because of containing carcinogenic substance styrene by limitation. Filling of 　 of 1.2 heat-resisting filling is the main component of EP adhesive, appropriate filling can reduce the manufacturing cost of adhesive not only, still can increase mechanical function and hear resistance, [13] among them filling of class of new-style accept rice already became research heat. The S.N.MA accept rice that uses modified of activator of classics anion surface 2 oxidation silicon and epoxy resin of modified of balata of liquid fourth nitrile, the epoxy resin adhesive that uses preparation of solution casting method can be in cold curing and can be able to bear or endure suffer high temperature. Consider to make clear, when accept rice the quality mark of 2 oxidation silicon is 2% when, the shear strength of adhesive is 17.9 MPa, [14]T achieves 216.5 ℃ . Katsoulis studied filling of class of different accept rice is right the double luscious group of the MY721 of 4 luscious round epoxy resin of solidify of G high temperature and microtherm solidify child of solidify of epoxy resin LY5052 bears the influence of lukewarm function. Consider to make clear, to epoxy resin of cold curing LY5052, filling changes vinyl to contain bromine the clay of 3 phenyl phosphor or for via modified of ion of 18 alkyl ammonium when covering ground, room temperature [capability of 15] solidify production 400 ℃ high temperature. The Makom-1 that Gladkikh S N develops adhesive with mineral as filling, have be able to bear or endure goodly sex of wet oil resistant, it is in temperature - 10 ℃ begin solidify namely, in 20 ～ 25 ℃ condition issues 15 ～ 24 H can complete solidify, its are able to bear or endure lukewarm limits is - 150 ～ 200 ℃ . As research begin, the cold curing with a lot of good performance is high temperature resistant EP adhesive has begun to be sold in the market, if express,1 is shown. Among them EP21TCHT-1 adhesive is one kind but cold curing, have the annulus oxygen glue of tall thermal conductivity and exceedingly good insulating property, use temperature - 204 ℃ of 269 ～ , the line bilges coefficient is low, viscosity is low, stick receive performance exceedingly good, be used at microtherm to be reached except gas by NASA accredit use at vacuum environment.